MB86C69RBC the fujitsu 26-port 10gbps ethernet switch chip features mature field-proven architecture to tal of 28 ethernet ports - 26 ethernet ports that are configurable to operate at 10gbps or 1gbps wire speed -t wo additional 1gbps ethernet management ports on-chip micro-engine for management eeprom interface used for initialization 2 i 2 c interfaces 2 mdio interfaces integrated high-performance serdes - integrated kr/xaui/cx4/sgmii serdes for all 26 high-speed ports - kr capabilities for all 26 high-speed ports -a daptive rx equalization, which eliminates the need for expensive external clock re-timer circuitry 520+ gbps of non-blocking switching capacity cut-through switching mode for latency-sensitive applications support for eight classes of service per port strict or deficit round robin used for priority scheduling committed and peak information metering used for traffic shaping ultra-low pin-to-pin switching latency advanced ethernet class features -p er priority pause - backward congestion notification support - early packet-drop congestion-avoidance capabilities based on ingress and egress buffer usage layer 2 capabilities - unicast and multicast forwarding, address learning and a ging - 16k+ mac address table - support for up to 16k jumbo frames - stp/rstp/mstp capable - link aggregation (802.3 clause 43) - 802.3ae full-duplex operation using pause flow control - l2 acl - vlan translation -v lan table with 4k of vlan (802.1q) address - user-programmable vlans - extended vlan capabilities for up to 64 logical partitions - shared and independent vlan learning capabilities layer 3 features - l3 forwarding with 16k ip address table - igmp and mld snooping capabilities - diffserv for ipv4 and ipv6 - l3 acl monitoring -p ort and vlan mirroring - rmon and smon statistics counter -f low (rfc3176) support 802.1x port security filtering based on source mac address dos-attack detection support t ypical 22w power consumption under full load conditions large 2.9mb integrated memory 90nm technology smallest (35mm x 35mm) footprint in the industry 26+2 port ethernet switch 26 x 10gbe ports 2 x 10/100/gbe ports xaui/10g serial-kr i 2 c 10g serial mmi/gmii mmi/gmii xaui xaui 10 gbe 10gbe 10 gbe 10gbe 10 gbe 10gbe xfp xenpak cx4 connector eeprom processor 10/100/gbe phy 10gbe
MB86C69RBC benefits ? he fujitsu 26-port switch is the highest density, lowest power 10gbe switch available today, making it ideal for backplane fabrics or interconnect applications. integrated programmable high-speed serdes allows each port to be either kr, xaui, cx-4 or 1000 base kx or sgmii compatible, enhancing flexibility. 10gbps serial capabilities enable direct connect to xfp modules or 10gbps serial-kr backplanes, reducing board space, latency, cost and power consumption. fully compliant 10gbps serial kr capabilities enable designers to use fewer physical backplane fabric connections. an adaptive equalization algorithm eliminates the need for an external re-timer circuit in cx-4 cabling, saving board space, power, latency and cost. ? edundant gigabit ethernet ports give users a high-availability agnostic management interface that is not tied to any particular processor. ? he on-chip micro-engine increases flexibility and simplifies software development, reducing time to market. congestion management features, including backward congestion notification (bcn) and per-priority-pause (ppp), improve the performance and efficiency of the network, reducing the total cost of ownership. 13 x 10gbe ports 13 x 10gbe ports mmi/gmii mmi/gmii buffer management forwarding tables management microengine statistics shared memory prbs adaptive equalization pre-emphasis equalizer xaui or 10g serial tx rx
the fujitsu 26-port 10gbps ethernet switch chip applications embedded next-generation, high-density backplane s witching applications blade-server switching applications ? dv ancedtca carrier board backplane fabric applications t ca mch applications ? o w-latency interconnects for high-performance cluster computing iscsi storage 4 x 10gbe 16 x 10gbe 16 10gbe kr ports carrier card a/b a/b a/b security chip amc atca blade server 26 10gbe ports rack mount server chassis traffic manager amc network processor processor amc 10gbe 10gbe 10gbe 10gbe 10gbe 10gbe 10gbe 10gbe 10gbe 10gbe 10gbe 10gbe 10/100/gbe xfp port 2 xaui or 10gbps serial- kr xaui or 10gbps serial- kr xaui or 10gbps se rial-kr xaui or 10gbps se rial-kr xfp port 3 xfp port 4 rj45 port 1 xfp port 1 rj45 port 2 backplane connector backplane connector 1 0 g s e r i a l 1 0 g s e r i a l 1 0 g s e r i al 10g serial s g m i i s g m i i processor mii/gmii xfp port 5 xfp port 6 1 0 g s e r i a l 1 0g s e r i a l xfp port 1 processor xfp port 2 xfp port 3 xfp port 25 xfp port 26 1 0 g s e r i a l 1 0 g s e r i a l 1 0 g s e r i a l 1 0 g s e r i a l 10 /100/1000
MB86C69RBC fujitsu microelectronics america, inc. corporate headquarters 1250 e. arques avenue, m/s 333, sunnyvale, ca 94085-5401 t el: (800) 866-8608 fax: (408) 737-5999 e-mail: inquiry@fma.fujitsu.com web site: http://us.fujitsu.com/micro ? 2008 fujitsu microelectronics america, inc. all company and product names are trademarks or registered trademarks of their respective owners. printed in the u.s.a. 10ge-fs-21297-3/2008 description fujitsu s new multi-rate 10gbe, high-density switch chip embeds 26 high-bandwidth, full-duplex 10gbps ports into a single, integrated, small-footprint package. each port has the flexibility to support kr, xaui, cx-4 or sgmii. the use of adaptive equalization on each port can increase reach f or xaui, cx-4 and 10gbps serial applications as well as eliminate the need for external re-timer circuits, reducing board space, power consumption and cost. w ith 10gbps serial capabilities on each port, the fujitsu MB86C69RBC can directly connect to optical xfp modules or 10gbps serial-kr backplanes (802.3ap compliant) on any port, eliminating the use of third-party serdes chips. this r educes board complexity, lowers costs, and cuts down development time. t he chip offers 520gbps of non-blocking aggregate s witching capacity in both cut-through and store-and-forward modes of operation. a switching latency of 300ns (including serdes in cut-through mode) makes the switch ideally suited f or high-density, latency-sensitive applications. because it was fabricated in 90nm technology, the chip provides a typical power consumption of 22w under full load conditions, the lowest power consumption, highest density 10gbps ethernet switch chip in the industry. this makes the MB86C69RBC well-suited for environmentally conscious, low-power, green applications. eight priority classifications per port allow priority s witching based on diffserv, mac address, vlans, extended vlans and ports. carrier-grade ethernet features include priority pause, backward-congestion notification and early drop capabilities for congestion av oidance. these features, in combination with the largest bu f fer memory in the industry, allow the MB86C69RBC to handle both best-effort and guaranteed-high-availability customer traffic in a single chip. in addition to the standard 4k vlan and qinq capabilities, the switch chip provides 64-user vlan addresses that can be used to logically partition a network without the use of qinq. vlan translation capabilities allow users to translate vlans from external customers to vlans from internal providers. t he switch chip provides two 10/100/1000 ethernet management interfaces. an agnostic interface allows the chip to communicate with any third-party processor. two i 2 c interfaces and two mdio interfaces permit low-speed communication with third-party external devices. both the switch and an integrated on-chip micro-engine can be initialized using an external eeprom, simplifying the initialization sequence and allowing the user to customize the s witch initialization. the on-chip micro-engine executes commands sent by the ethernet management interface. t his simplifies software development, increases flexibility and r educes time to market. the capability to initialize the switch through eeprom also allows designers to bring up the s witch along with the rest of the hardware without any software development in place. t he fujitsu MB86C69RBC module is the industry s most advanced, high-density switching architecture, providing a low-latency, low-power, feature-rich switch in a small form factor. the switch chip is well-suited for the l2+ switch box and the next-generation backplane fabric applications such as are seen in advancedtca, ?ca and blade server platforms.
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